3d full-field deformation measuring technique using digital image correlation

dc.contributor.authorNadarajah, S
dc.contributor.authorArulkumar, V
dc.contributor.authorMallikarachchi, C
dc.contributor.editorWeeraddana, C
dc.contributor.editorEdussooriya, CUS
dc.contributor.editorAbeysooriya, RP
dc.date.accessioned2022-08-15T05:58:16Z
dc.date.available2022-08-15T05:58:16Z
dc.date.issued2020-07
dc.description.abstractFull-field deformation measurements are crucial as it offers detailed information to better understand both micro and macroscopic nature of material behavior. The practice of employing Digital Image Correlation (DIC) based measuring techniques in experiments has increased due to its ability to generate full-field deformation information with minimal effort. Even though DIC systems are commercially available, the affordability of those systems is questionable in local context due to high capital costs. Most of the past studies related to DIC were focused on testing concrete, masonry and metallic alloy specimens, and little effort has been made on materials with recoverable large elongations. This paper presents a 3D fullfield deformation measuring system that has been developed with a special focus on hyperelastic materials. The proposed system requires two common digital cameras for image acquisition, as the depth information is of interest. Images are then processed using the MATLAB-based algorithm developed to produce the full-field deformation map. Hyperelastic specimens of two different thicknesses were tested over 70% strain and the accuracy of the strain measurement using the proposed system is validated against physical measurements. The results have shown that the strains can be captured to an accuracy greater than 90% using the proposed technique.en_US
dc.identifier.citationS. Nadarajah, V. Arulkumar and C. Mallikarachchi, "3D Full-Field Deformation Measuring Technique Using Digital Image Correlation," 2020 Moratuwa Engineering Research Conference (MERCon), 2020, pp. 1-6, doi: 10.1109/MERCon50084.2020.9185343.en_US
dc.identifier.conferenceMoratuwa Engineering Research Conference 2020en_US
dc.identifier.departmentEngineering Research Unit, University of Moratuwaen_US
dc.identifier.doi10.1109/MERCon50084.2020.9185343en_US
dc.identifier.emailnsujeeka@gmail.comen_US
dc.identifier.emailshanthivithu@gmail.comen_US
dc.identifier.emailyasithcm@uom.lken_US
dc.identifier.facultyEngineeringen_US
dc.identifier.pgnospp. 1-6en_US
dc.identifier.placeMoratuwa, Sri Lankaen_US
dc.identifier.proceedingProceedings of Moratuwa Engineering Research Conference 2020en_US
dc.identifier.urihttp://dl.lib.uom.lk/handle/123/18628
dc.identifier.year2020en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.relation.urihttps://ieeexplore.ieee.org/document/9185343en_US
dc.subjectdigital image correlationen_US
dc.subjectimage processingen_US
dc.subjectfullfield deformation mapen_US
dc.subject3D reconstructionen_US
dc.subjecthyperelastic materialen_US
dc.title3d full-field deformation measuring technique using digital image correlationen_US
dc.typeConference-Full-texten_US

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